| 摘要 |
PROBLEM TO BE SOLVED: To enable the wire bonding connection to reduce the cost of a semiconductor device having staggeringly disposed bonding electrode pads. SOLUTION: Bonding wires 2 connected to outer bonding electrode pads 9 have each a connect loop height on the pads than that of bonding wires 3 connected to inner bonding electrode pads 10 and are connected to inner bonding parts 16 while the inner bonding electrode pads 10 are connected to outer bonding parts 15. The connection loop heights outside inner leads 5, 6 and those near the inner bonding parts 15, 16 are alternately changed. |
