| 摘要 |
PROBLEM TO BE SOLVED: To make the package small in size and low in producing cost by constituting the package of an opaque base component in which optical elements having a defined LED array and central opening are formed and electrical mutual connecting sections are incorporated. SOLUTION: The package includes an LED display chip 14 which is formed by a light-transmissive substrate having a principal plane on the central section of which an array of light emitting elements is formed to generate a complete image in cooperation. The base 30 formed as a molded component has a principal plane and defines the central opening roughly on the extension line of the image at the central section of the principal plane of the light-transmissive substrate of the chip 14. The molded base component 30 further has plural built-in conductors 31 each of which reaches to, for example, plural electrically connecting means 33, such as connecting/fixing pad, from plural connecting/ fixing pads formed next to the edge of the central section. A lens is formed inside the window by injection-molding in succession to the molding of the base components 30. |
