发明名称 BONDING WIRE AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a bonding wire which little cause the loop trouble even in the form of a long looped wire and manufacture thereof. SOLUTION: The bonding wired has at least a film of a mineral oil, animal/ plant oil, synthetic oil or surfactant formed on the surface of a very thin metal wire by the dip electrodeposition or spray coating. This film thickness has a gradient measured by the atmospheric ultraviolet photoelectron method i.e., normalized photoelectron absorption Y divided by exciting energy eV is 15-40Y/eV, pref. 20-30Y/eV in this method.
申请公布号 JPH1050754(A) 申请公布日期 1998.02.20
申请号 JP19960204703 申请日期 1996.08.02
申请人 SUMITOMO METAL MINING CO LTD 发明人 KUBO TOSHIYUKI
分类号 H01L21/60 主分类号 H01L21/60
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