HIGH FREQUENCY HYBRID INTEGRATED CIRCUIT

摘要

PROBLEM TO BE SOLVED: To make a substrate thin by restraining loss of a microstrip line in a multilayer substrate which is used for a high frequency hybrid integrated circuit. SOLUTION: Partial grounding metallic planes 9, 10 are provided between layers of a multilayer substrate comprised of high temperature baked ceramic such as alumina or aluminitride and are partially formed between different layers of a substrate. A microstrip line is constituted of a metallic wiring 2 of a surface and the partial grounding metallic plane 9 and a pair of microstrip lines are constituted of partial grounding metallic planes 5, 10.