| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board in which a lid portion covering an electronic part placing hole formed during the formation of outer layer circuit with copper foil etching process can be easily peeled off in the method for producing a multi-layer printed wiring board, by forming the outer layer circuit in a state where the inside of electronic part placing hole is protected by the copper foil. SOLUTION: According to this method, a multi-layer board 11 is formed. Then, a lid portion 3 covering an outer layer circuit 9 and an electronic part placing hole 2 is formed, next, this lid portion 3 is peeled off and the electronic part placing hole 2 is opened. At this time, an adhesive force of an adhesive material 8a used for an adhesive region 7 of the lid portion 3 is made smaller than the adhesive force of an adhesive material 8b used for a position for forming the outer layer circuit 9. Also, when forming the multi-layer board 11, a non-adhesive sheet larger than the opening of an electronic part placing hole and smaller than the outer periphery of the lid portion 3 is used to cover the electronic part placing hole with copper foil 6 through the non-adhesive sheet, by using the copper foil 6 adhered to the inner side of the range forming the lid portion at the adhesive surface side of the copper foil 6.</p> |
