ELECTRONIC ELEMENT COOLING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide an electronic element cooling structure which has a high cooling power to electronic elements and prevents other members in a package than the electronic elements from increasing temp. SOLUTION: The structure for cooling heating electronic elements 7 in a package 5 comprises a small-aperture flexible heat pipe 8 disposed so that its one end can transfer the heat with the element 7 and a heat sink 10 can transfer the heat with the other end of the pipe 8. An intake 12 is communicated with the heat sink 10 in one body and fan 11 is disposed to blow air to outside of the package.