| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multi-layer printed wiring board with excellent reliability and reliable insulation, at a place where wiring patterns are superimposed each other. SOLUTION: According to this method, a conductive layer is placed on a conductive substrate, a plurality of original plates each having an adhesive insulating resin layer laminated on the conductive layer and a pattern layer are produced as original plates for transfer. Then, the original plate for transfer is adhered under pressure to one surface of a substrate 2 for a multi-layer printed wiring board 1 to transfer the wiring pattern layers 3, 4 and 5 by sequentially peeling off the conductive substrate, the above steps are repeatedly processed, a plurality of wiring pattern layers 3, 4 and 5 are laminated on the substrate 2, and the multi-layer printing wiring board is produced. At this time, an interlayer insulation layer is formed on the same track over wiring pattern layers 3, 4 and 5 transferred in advance before laminating the wiring pattern layers 3, 4 and 5. |
