发明名称 |
Chip card for bidirectional data transmission with or without contact |
摘要 |
The card has a body (5) of plastic (e.g. polycarbonate) enclosing an induction coil (3) which is exposed e.g. by machining in the vicinity of a point of connection (2) where a metallic strip is deposited on the substrate (e.g. plastic film) (6) of the module. The connection here is made by anisotropically conductive adhesive (4) deposited over the entire surface and compressed locally so that its embedded microspheres (7) of metallised plastic contact one another between the strip and coil. Such an adhesive enables the body and substrate to be joined when the conductive connection is made by the hot melt method.
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申请公布号 |
DE19632814(A1) |
申请公布日期 |
1998.02.19 |
申请号 |
DE19961032814 |
申请日期 |
1996.08.14 |
申请人 |
SIEMENS AG, 80333 MUENCHEN, DE;PAV CARD GMBH, 22952 LUETJENSEE, DE |
发明人 |
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分类号 |
G06K19/077;H05K3/32;(IPC1-7):G06K19/077;H05K1/18;H05K1/16;H05K1/11 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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