Pressure sensor chip with protective membrane and transfer element and force sensor
摘要
The device has a structured protective membrane chip (10) with which a structured force sensor chip (11) and a carrier chip (12) are connected. The plate type protective membrane and force sensor chip elements are hermetically connected together. On their adjacent surfaces these have identical chambers. In the centre of these are identically structure raised features. These locate with each other precisely for force transfer. The carrier chip is provided with a bonding layer and is structured such that free spaces are provided for the membrane distending and the metallisation of the piezoresistive sensor elements. The chips (10,11,12) preferably comprise a micro-structurable material and can be connected to each other by bonds.
申请公布号
DE19644830(C1)
申请公布日期
1998.02.19
申请号
DE19961044830
申请日期
1996.10.29
申请人
DAIMLER-BENZ AKTIENGESELLSCHAFT, 70567 STUTTGART, DE