| 摘要 |
A method for coating semiconductor element with resin by which a semiconductor element can be easily and quickly coated with a coating resin. In the method for coating the semiconductor element (2) used for a liquid panel (1) with a coating resin (14), the resin (14) is molded in a sheet-like state and the resin (14) is put around the element (2), and then, the element (2) and its periphery are moisture-proofed by coating them with the resin (14) and hardening the resin (14). Such a resin that is cured through a chemical reaction caused by heating, an ultraviolet-curing resin, etc., can be used as the coating resin (14). When a through hole (16) or recessed section is provided at the central part of the resin (14) and the resin (14) is put on the element (2) by sliding or putting the hole (16) or recessed section on the element, the position of the resin (14) can be fixed against the element (2). |
