| 摘要 |
A heat producing component such as a power amplifier (27) is mounted on a heat sink (10) which is in turn mounted on a circuit board (26). The heat sink is made of a single piece of metal folded into the shape shown, and includes a resilient member (22), formed by cutting and bending the metal, which cooperates with lugs (20,21,Fig.1, not shown) to urge the component into contact with a surface of the heat sink. The component is soldered to the heat sink, which is also soldered to the circuit board. The assembly is then placed in a case, the top half of which (32) is a further heat sink which abuts the protruding arms (11,12) of the heat sink and also serves as a ground plane. |
