发明名称 Cooling of electronic devices mounted on a circuit board
摘要 A cooler-equipped printed circuit board (10) in which electronic devices (3) arranged in a matrix form on the printed circuit board are covered with a sealed case (20) held in liquidtight contact with the board and having a coolant channel from an inlet port (61) and an outlet port (62) made in the case. Barriers (24) are provided in the coolant channel to change the direction of flow of the coolant to stir it and make its temperature uniform throughout it. In further embodiments, components mounted on both sides of the circuit boards are cooled by providing a through hole in the board, and providing board (see e.g. Fig.8A). Also, components which require less cooling can be located outside the case and be subjected to air cooling by a fan (see Fig.12).
申请公布号 GB2316237(A) 申请公布日期 1998.02.18
申请号 GB19970016544 申请日期 1997.08.06
申请人 * ADVANTEST CORPORATION 发明人 KAZUNARI * SUGA;AKIHIRO * FUJIMOTO
分类号 H01L23/473;H05K7/20;(IPC1-7):H05K7/20 主分类号 H01L23/473
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