发明名称 |
Printed circuit board, IC card, and manufacturing method thereof |
摘要 |
<p>In a method for manufacturing a printed circuit board, this printed circuit board can be manufactured by executing a simple manufacturing step within a short time period in low cost without requiring a complex manufacturing step. A conductive material is pattern-printed on a base board (1) and the printed conductive material is hardened to form a first conductor layer (2). Subsequently, an insulating material is pattern-printed on the first conductor layer (2), and the printed insulating material is hardened to thereby form a first insulating layer (3). A manufacturing step similar to the above-described step is repeatedly performed to thereby form a second conductor layer (4), a second insulating layer (5), and a third conductor layer. Furthermore, a manufacturing step similar to the above-explained step is repeatedly performed, so that a printed circuit board having a multi-conductor layer can be manufactured. <IMAGE></p> |
申请公布号 |
EP0824301(A2) |
申请公布日期 |
1998.02.18 |
申请号 |
EP19970113494 |
申请日期 |
1997.08.05 |
申请人 |
HITACHI, LTD. |
发明人 |
SHIRAI, MITSUGU;KAZUI, SHINICHI;SASAKI, HIDEAKI;FUJIKAWA, KEIJI;MATSUOKA, MAKOTO |
分类号 |
H01L23/498;H05K3/46;(IPC1-7):H05K3/46;H05K3/28;H05K3/32;H01L21/48;H01L23/538;H01L23/32;G06K19/077 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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