Treatment method of semiconductor wafers and the like and treatment system for the same,申请号GB19970026603-传众专利搜索

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发明名称	Treatment method of semiconductor wafers and the like and treatment system for the same
摘要
申请公布号	GB9726603(D0)	申请公布日期	1998.02.18
申请号	GB19970026603	申请日期	1997.12.18
申请人	SUGAI CORPORATION	发明人
分类号	B08B3/08;B08B3/10;H01L21/00;H01L21/304;H01L21/306	主分类号	B08B3/08
代理机构		代理人
主权项
地址

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