发明名称 ELECTRONIC EQUIPMENT CASE AND ITS MANUFACTURE
摘要 <p>PROBLEM TO BE SOLVED: To reduce the manufacturing manhours by making the handling of a conductive body easy and simultaneously molding integrally the conductive body with a plurality of tongues and a frame. SOLUTION: In the constitution of a case in which an upper frame and a lower frame 5 are fitted splittably through a conductive plate 71 for connecting electrically the frames, one frame is constituted of an integrally molded composite body composed of the conductive plate 71 with a plurality of tongues 711 formed on a U-shaped notched channel on its fitting face, an auxiliary plate with small holes corresponding to the tongues 711 and resin coating the plates, and the tongues 711 are folded and protruded on the fitting face side by the resin injecting force at the molding time.</p>
申请公布号 JPH1044184(A) 申请公布日期 1998.02.17
申请号 JP19960208266 申请日期 1996.08.07
申请人 FUJITSU LTD 发明人 ISHIZUKA MASANOBU;NISHII KOTA;KIMURA KOICHI
分类号 H05K5/00;B29C33/12;B29C45/14;B29K101/12;B29K705/00;B29L22/00;B29L31/34;G06F1/16;H05K9/00;(IPC1-7):B29C45/14 主分类号 H05K5/00
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