发明名称 |
Extended surface cooling for chip stack applications |
摘要 |
A heat sink is provided for use with stacks of integrated circuit chips. The heat sink comprises a thermally conductive body having a recess in which the chip stack is disposed. The heat sink also includes fins which extend away from the recess. In one embodiment, fins are provided inside the recess for improved cooling of higher power chips such as a microprocessor which is surrounded by less thermally demanding memory chips. |
申请公布号 |
US5719745(A) |
申请公布日期 |
1998.02.17 |
申请号 |
US19960716801 |
申请日期 |
1996.09.16 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
AGONAFER, DEREJE;ANDERSON, TIMOTHY MERRILL;CHRYSLER, GREGORY MARTIN;CHU, RICHARD CHAO-FAN |
分类号 |
H01L25/065;H01L25/18;(IPC1-7):H05K7/20 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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