| 摘要 |
PROBLEM TO BE SOLVED: To avoid an original high function of an IC card from being impaired due to heat of a semiconductor element in the interior portion of an IC card formed by a sealed metal case with respect to radiation and cooling means of an IC card. SOLUTION: In the interior portion of an IC card, pipes 202 capable of flowing a fluid being a coolant are formed in a metal case 201 that comes in contact therewith through an IC 205 and insulation body 206 of a gearing body. By flowing a fluid being a coolant within the pipes, heat is transmitted to the fluid flowing in the pipes. The heat-retaining fluid flowing in the pipes flows to the exterior portion of the IC card, thereby controlling the temperature of the heat body, and further controlling the temperature within the interior portion of the IC card. Also, there are formed notches for increasing the surface area on the surface exposed to an external atmosphere, i.e., being a metal molded case. |
