Method for making a debossed conductive film composite

摘要

Processing of materials and their combination to produce a thin foil-laminated adhesive dielectric thermosetting resin film and the conversion of it by a mechanical debossing procedure to impart a debossed and/or embossed printed circuit pattern directly thereon. A process for compositing a shaped metal foil containing a debossed electrical circuitry pattern and an thin isotropic uncured and ungelled thermosetting resin film and forming an adhesively joined composite conforming essentially to the shape of the predebossed metal foil. The process comprises placing a shaping tool with a surface possessing an embossed electrical circuitry pattern, as described in the prior art, and forcing the shaped surface and a surface of the metal foil into intimate contact to deform the metal foil to assume essentially the shape of the tool surface. The shaped metal foil is separated from contact with the tool surface. The separated metal foil is placed in contact with a thin isotropic uncured and ungelled thermosetting resin film. It is forced into the film without significantly altering its shape. This causes the film to deform and assume the shape of the foil. The condition associated with the film in contact with the foil are such that the film assumes a set condition and the foil is adhesively bonded to the film.