发明名称 Multilayer printed wiring board with plurality of ground layers forming separate ground planes
摘要 A printed board 10 is provided with two ground layers 3a, 3b. These ground layers 3a, 3b are electrically insulated inside the printed board. By connecting circuits with different characteristics (low frequency and high frequency, for example) with the different ground layers 3a, 3b, interference of these circuits caused due to a common ground can be minimized.
申请公布号 US5719750(A) 申请公布日期 1998.02.17
申请号 US19960676103 申请日期 1996.07.02
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 IWANE, YASUSHI
分类号 H05K1/02;H05K1/00;H05K3/46;H05K9/00;(IPC1-7):H05K1/11;H05K7/02 主分类号 H05K1/02
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