| 摘要 |
PROBLEM TO BE SOLVED: To realize semiconductor wafers having curves shapes by a method wherein a stage, on and to which a block to be cut is installed and fixed, can become movable also normal to the direction for approaching to and separating from a wire. SOLUTION: Under the condition that wire guides 3 are fixed, a stage 2, to which a workpiece 1 is fixed, is lowered by its driving part towards a wire 4 in order to cut the workpiece vertically. Further, the stage 2 is made movable to the longitudinal direction of the workpiece 1 or to the C- and D-directions. Concretely, by moving the stage 2 to the positionally fixed wire 4, a semiconductor ingot 1 fixed to the stage 2 is cut into the desired shapes such as semiconductor wafers having the curved surface shape. |
