Polyamide based on dimer fatty acid

摘要

PCT No. PCT/EP95/00817 Sec. 371 Date Sep. 11, 1996 Sec. 102(e) Date Sep. 11, 1996 PCT Filed Mar. 6, 1995 PCT Pub. No. WO95/24439 PCT Pub. Date Sep. 14, 1995A composition of matter useful as a hotmelt adhesive is provided. The adhesive comprises a polyamide based on dimerized fatty acid, preferably having an amine value of less than 2, and at least one heat stabilizer for polyvinyl chloride, preferably selected from the group consisting of alkyl tin carboxylate compounds and epoxy compounds. The heat stabilizer is preferably present in an amount of 0.2% to 10.0% by weight of the composition. Also provided is a method of using the composition as a hotmelt adhesive for polyvinyl chloride.