| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to miniturize by sharply reducing planewise dimensions by a method in which a light emitting element is mounted on the die bonding area of a light receiving element, and the light receiving element, the light emitting element and a circuit part are encapsulated with light transmitting resin. SOLUTION: Light transmitting resin 20 consists of epoxy resin containing a visible light cutting agent, and it is used to encapsulate a light emitting element 16, a light receiving element 14 and a circuit part 18. This light transmitting resin 20 has a two stage lens a 20 having a part, corresponding to the light receiving element 14 and a light emitting part 16, heaved up like a snowball. The lower lens part 20b condenses the inflared rays coming from outside in the direction of the light receiving element 14, the upper lens part 20c condenses the inflared rays coming from the light emitting element 16 and the light is outwardly projected. Accordingly, as the light emitting element 16 is superposingly mounted on the upper surface of the light receiving element 14, the mounting space of a substrate 12, on which the light emitting element 16 is mounted, is unnecessitated, and the size in lateral direction of the inflared transmitting/receiving module can be reduced. |
