| 摘要 |
PROBLEM TO BE SOLVED: To obtain an easily manufacturable and highly reliable structure of a multi-point conductive sheet, in which conductor wiring is buried, by removing many particles buried in an insulating sheet consisting of a thermoplastic synthesized resin sheet, etc., to form many through holes, and by disposing an electrically conductive material in each through hole. SOLUTION: A thermoplastic synthetic resin sheet is used as an insulating sheet 1, and the thermoplastic synthetic resin sheet, in which many particles 2 are buried, is prepared. The particles 2 are removed from this thermoplastic synthetic resin sheet and many through holes 3 penetrating the sheet in the thickness direction thereof are formed in the surface of the sheet. A conductive material 4 is disposed in the through holes 3 to form a multipoint conductive sheet. This electrically conductive material is used as wiring contacts for connecting wiring patterns in case of forming a multi-layer wiring board. Thus, an easily manufacturable and highly reliable structure of a multi-point conductive sheet, in which conductor wiring (conductive material) is buried, can be obtained. |
