摘要 |
PROBLEM TO BE SOLVED: To supply a specific amount of solder to a specific position on a mount part by arranging a press part, which is movably arranged while applied with a downward force along the axis of a solder supply nozzle and has its lower end made to abut against the mount part, at the outer periphery of the solder supply nozzle. SOLUTION: If the mount part to be supplied with solder floats over a guide rail 2 because of the deformation of a suspension pin, the lower end of the press part 14 which moves down abuts against the lifted part of the mount part 11. When the mount part is further moved down, the press part 14 abutting against the mount part 11 is relatively lifted, but the press part 14 is applied with the elastic force of a spring 16, so the lifted part of the mount part 11 is pressed to correct its attitude, so that the mount part is pushed down while the distance between the mount part 11 and the lower end of the nozzle 5 is held constant. Consequently, the floating mount part is brought into contact with the guide rail and a specific amount of solder can be supplied to the specific position of the mount part.
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