发明名称 THICK-FILM PATTERN FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To simplify a process when a thick-film pattern is formed by a sandblasting method, and to permit compatibility between grinding workability and high precision of a finished pattern by reducing the damages caused by sandblasting to other constitutive materials. SOLUTION: A transcription sheet 10, constituted by forming an adhesive resin layer 12 having photosensitivity on a base film 11, is patterned exposed. Then, this transcription sheet 10 is laminated on a pattern formation layer 15, so that an unhardened part 12b of the adhesive resin layer 12 penetrates into an upper part of the pattern formation layer 15. After the base film 11 has been exfoliated to eliminate a hardened part 12a, a sandblasting process leaves only a pattern formation material, corresponding to a penetration part, thus forming a thick-film pattern after a burning process.
申请公布号 JPH1040808(A) 申请公布日期 1998.02.13
申请号 JP19970054836 申请日期 1997.03.10
申请人 DAINIPPON PRINTING CO LTD 发明人 KURAMOCHI SATORU;KOSAKA YOZO;ASANO MASAAKI
分类号 G03F7/004;B24C1/04;G02F1/1339;G03F7/34;G03F7/40;H01J9/02;H01J9/227;H01J11/22;H01J11/26;H01J11/34;H01J11/36;H01J11/38;H01J11/44 主分类号 G03F7/004
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