| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical element bonding equipment wherein an optical element and a board can be bonded holding an initial position which is previously set, by restraining generation of positional deviation of the optical element and the board even.if stress is generated when fixing medium like solder is cooled. SOLUTION: This optical element bonding equipment 1 bonds an optical element 8 to a board 11 mounted on a movable table 10 capable of freely moving in a two-dimensional plane defined by X, Y axes. A bonding head 2 and a moving member 3 capable of freely moving in the Z axis direction which perpendicularly intersects the two-dimensional plane are installed. The bonding head has a sucking hole 2b, and the moving member 3 has a heating source 4 and a vacuum port 3c. The bonding head 2 is detachably fixed to the moving member 3. |
