| 摘要 |
<p>PROBLEM TO BE SOLVED: To minimize the package size and the number of lead terminals by a method wherein a dielectric chip is partly removed to be formed into non-standard shapes for arranging an IC in the removed part while reducing the dispersion in the wire length as well as increasing the occupancy efficiency of the package area by mounted parts. SOLUTION: The electronic device 10 is composed of a dielectric chip 1 and an IC 2 mounted on a package 3. Within the dielectric chip 1 in a square shape, a hole is made in a rectangular central part so as to form a removed part 8 for mounting the IC 2 in the part 8. Thus, the spaces between the input output pads 4 of the dielectric chip 1 and the input output pads 5 of the IC 2, between the input output pads 4 and the lead terminals 6, and between the input output pads 5 of the IC 2 and the lead terminals 6 are connected by wires 7 thereby enabling the number of the lead terminals 6 and the size of the package 3 to be minimized, the distances between said input output pads 4, 5 and the lead terminal 6 to be almost equalized to reduce the dispersion in the distances.</p> |
