| 摘要 |
PROBLEM TO BE SOLVED: To improve heat shock resistance of a unit for connecting an electronic component to a board. SOLUTION: The unit 1 comprises an electronic component 2 having electrodes 4 with bumps 8, board 3 having electrodes 5, conductive connection members for electrically connecting the bumps 8 and terminals 5, and sealant for bonding the component 2 and board 3. They are set so that b>a and c>0.02mm; a is diameter of the bump 8, b is thickness of the sealant 6 between the component 2 and board 3, and c is gap between the bump top and terminal 5. This enough relaxes the thermal stress acting on a connection 10. |
