APPARATUS AND METHOD FOR HOLDING SUBSTRATE AND EXPOSURE APPARATUS

摘要

PROBLEM TO BE SOLVED: To ensure a wide contact area with a substrate at holding of the substrate and reduce the static charge when striping the substrate. SOLUTION: A part of a substrate mounting plane 50 is composed of movable members 55a-55e. For vacuum-chucking and holding a substrate 6, the movable members are moved to a first position slightly inside the mounting plane 50 and vacuum grooves 51a-51e are evacuated to suck the substrate. A Bernoulli chuck acts to instantaneously fully contact the substrate to the mounting plane 50. For peeling the substrate from the mounting plane 50, the surfaces of the movable members 55a-55e are lowered to a second position more inside the first position to reduce the contact area of the substrate with the mounting plane 50 before peeling. The substrate is then lifted up by center up members 38a-38d to peel the substrate from the mounting plane 50.