| 摘要 |
PROBLEM TO BE SOLVED: To prevent local application of high pressure to a semiconductor layer by the metal material contained in conductive paste when an electrode is formed by a printing method by a method in which resin material is provided between the conductor of the lowest layer of multilayer conductor and a semiconductor layer. SOLUTION: First, the first resin layer 205 is formed on a NIP type semiconductor layer 203 by a printing method. Then, a groove 301, which becomes an outer lead-out electrode part, is formed by the irradiation with a laser beam. Then, the second resin layers 303 and 304 are formed by a printing method. These resin layers having a function which fill up the groove with resin material, and also they function as the interlayer insulating film which becomes the base layer of the contact electrode to be formed thereon. Then, a contact electrode 307 is formed by a printing method using silver paste. At this time, the damage of the semiconductor layer 203 can be prevented by the presence of the resin layer 205 and the silver particles contained in the silver paste. |
