| 摘要 |
PROBLEM TO BE SOLVED: To stably form metal balls for a long time by preventing metal particles from rapidly depositing on the surface of a torch electrode or capillary. SOLUTION: A wire passing through a bonding capillary 1 to protrude its part 2 from the capillary 1, a voltage is applied between this part 2 and torch electrode 3 to cause a spark discharge therebetween, thereby forming a metal ball on the wire top. In such a semiconductor device manufacturing method, the discharge start voltage is dispersed in the range of several hundreds volts to a thousand and several hundreds volts and adjusted so as to provide peaks at a lower and higher voltage zones of the dispersed voltage distribution. |
