| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire bonding capillary and a wire bonding method, enabling a wire bonding which ensures a good connecting condition of a connection between a bonding wire and inner lead, expands the area of substantial connecting regions in this condition, and avoids an abrupt rise of the wire near the connection. SOLUTION: The capillary 1 is used for wire bonding to electrically connect a bonding pad of a semiconductor chip die-bonded to islands of a lead frame of a semiconductor device to an inner lead of the lead frame. A tubular thin hole is bored through the axial center of the capillary. A wire pass through this hole to project its top from the top of the capillary. A cutting top end part P of the wire welded to the inner lead is cut. The peripheral edge of the top end portion of the wire from the part P has a first convex face A annularly formed round the part P and second convex face B annularly formed round the first face A. |
