| 摘要 |
PROBLEM TO BE SOLVED: To attain a small loss, low reflection and high isolation transmission by a method wherein the space between a base plate and a circuit assembly is provided with a base plate preform adaptive for the thermal expansion difference while the space between the circuit assembly and a lid is provided with a lid preform adaptive for the thermal expansion difference. SOLUTION: A packaging assembly 10 is provided with a conductive and adhesive base plate preform 12 arranged between a circuit assembly 16 with a base plate 14 and a pin. The base 2 preform works so as to adapt for the thermal expansion difference between the base plate 14 and the circuit assembly 16. Besides, a conductive and mechanically bonding lid preform 18 is arranged between the circuit assembly 16 and the lid 20 so as to mechanically and electrically attach the circuit assembly 16 and the lid 20 to be adpated for the thermal expansion difference between said two elements 16 and 20. Through these procedures, a small loss, low reflection and high isolation transmission to a PC substrate or SMA can be made feasible. |
