SUBSTRATE FOR MOUNTING SEMICONDUCTOR CHIP AND METHOD FOR MOUNTING SEMICONDUCTOR CHIP

摘要

PROBLEM TO BE SOLVED: To increase the junction strength between a semiconductor chip and a board not only by joining junction lands formed on the board for mounting a semiconductor chip and electrodes formed on the semiconductor chip but also by forming, on the board for mounting a semiconductor chip, a land for securing the strength to be joined to a non-operating electrode formed on the semiconductor chip and joining these to each other. SOLUTION: On a circuit forming face 1a of a semiconductor chip 1, a non-operating electrode 105 exists an usual that is an electrode for a unit test of a semiconductor chip that has nothing to do with the function of the semiconductor chip after the chip is mounted. In correspondence with the non-operating electrode 105, a land 103 for securing the strength which is not electrically connected to a wiring on a circuit board where a board 104 for mounting a semiconductor chip is to be mounted is formed on a semiconductor chip mounting face 4a of the board 104. Electrode terminals 13 and a junction land 102 are joined to junction materials 7 through bumps 6 and the non-operating electrode 105 and the land 103 securing the strength are also joined to a junction material 7 through a bump 6. By this method, the number of junction points increases and thereby the junction strength can be increased.