| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer wiring board wherein a wiring conductor is constituted as a thin film wiring conductor formed by using a thin film forming technique, miniaturization is realized by including a resistance element in the inside, and wiring density is high. SOLUTION: This multilayered wiring board consists of the following; an insulating board 1 having a through hole 5 penetrating an upper and a lower main surfaces, a conducting layer 6 introduced from the upper surface of the insulating board 1 to the lower surface via an inner wall of the through hole 5, organic resin filler 7 with which the inside of the through hole 5 is filled, and a multilayer wiring part 4 stuck on at least one main surface of the insulating board 1 wherein a plurality of organic resin insulating layers 2 and a plurality of thin film wiring conductors 3 are alternately arranged in multilayer, and a part of the thin film wiring conductors 3 is electrically connected with the conducting layer 6. A thin film resistance layer 10 is stuck on at least an organic resin insulating layer 2, and at least a pair of parts of the thin film wiring conductors 3 are brought into contact with the thin film resistance layer 10. A resistance element is electrically connected with the part between the thin film wiring conductors 3.</p> |
