| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip part mounting equipment capable of shortening time required for chip part mounting cycle and realizing a high productivity by high speed mounting. SOLUTION: This equipment comprises a chip take-out section 1 for supplying and taking out a chip part 9 which contains an adhesive sheet 8, a dicing pallet 7, a needle 6, a stage 16 and the like, an absorbing head section 2 freely movable having a plurality of absorbing nozzles 4 independently performing the absorption of the chip part 9 and ventral and rotating motions, and a movabletable section 3 equipped with a lead frame 11 as a mounting target and an adhesive sheet 12 for attaching a chip part 9 to the mounting position. |
