| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe card for semiconductor devices capable of preventing the generation of imperfect contact, on the occasion of inspecting the wafer of a pellet where contact pads are arranged in zigzag. SOLUTION: Board fitting positions (needle bases) for a probe card are arranged in zigzag, corresponding to contact pads arranged in zigzag. Concretely, protrusions 14a are provided at hem parts of a board opening, to make it possible to cause the needle bases 14 to correspond to the contact pads 16 (internal pads 16a and external pads 16b) on a pellet 15. Thereby, the lengths (A, B) of probes and the contact angles (α,β) between the probes and the contact pads are made equal (A=B,α=β) for the internal pads (16a) and the external pads (16b).
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