| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device which has a structure that replaces a defective IC chip without damaging normal IC chips when a plurality of IC chips are mounted. SOLUTION: At a bottom part 12A of a recessed part 12 provided on the rear side of a package board 10, an IC chip 20 is connected with its face down with solder bumps 23. On the rear side of the IC chip 20, a cap-shaped heat dissipating plate 30 is bonded with high melting point adhesive 24. On the outer plane of the summit 31 of the heat dissipating plate 30, an IC chip 40 is bonded with its face up with low melting point adhesive 33. To replace the IC chip 40, the adhesive 33 is melted for removal. To replace the IC chip 20, after removing the IC chip 40, the adhesive 24 is melted and the heat dissipating plate 30 is removed. Thus, the circuit surface of the IC chip 40 is not damaged and the IC chip 40 can be reused.</p> |
