The hot extrusion process involves using a cylindrical heating sleeve (12) that surrounds an extrusion die (11). The die has a main section in the form of a hopper with a 20mm diameter and this reduces in a cone section (111b) to a 2mm nozzle (16). The powder alloy of thermoelectric material (11a) is extruded by a plunger (13) while being heated at 200 to 580 degrees Celsius to produce a continuous pulverised sinter material out of thermoelectric semiconductor. e.g. of BixSbyTezSea. The sintered output is then cut into multiple elements.