发明名称 |
Advanced modular cell placement system |
摘要 |
A system for optimally locating cells on the surface of an integrated circuit chip is presented herein. The system comprises constructing a plurality of neighborhoods containing elements positionally related to one another; initially evaluating the lowest level of region hierarchy; iteratively developing a logical one-dimensional preplacement of elements on said surface; performing an affinity driven discrete preplacement optimization; evaluating whether a highest level of regional hierarchy has been attained; iteratively performing a dispersion driven spring system to levelize cell density and an unconstrained sinusoidal optimization; executing a density levelizing procedure; iteratively optimizing while controlling element densities; removing element overlap; iteratively optimizing for desired spacing between elements, adjusting element spacing, and permuting elements; locating elements on grid lines; and iteratively performing a functional sieve crystallization. |
申请公布号 |
WO9800796(A3) |
申请公布日期 |
1998.02.12 |
申请号 |
WO1997US11096 |
申请日期 |
1997.06.26 |
申请人 |
LSI LOGIC CORPORATION |
发明人 |
SCEPANOVIC, RANKO;KOFORD, JAMES, S.;ANDREEV, ALEXANDER, E. |
分类号 |
G06F17/50 |
主分类号 |
G06F17/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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