发明名称 Advanced modular cell placement system
摘要 A system for optimally locating cells on the surface of an integrated circuit chip is presented herein. The system comprises constructing a plurality of neighborhoods containing elements positionally related to one another; initially evaluating the lowest level of region hierarchy; iteratively developing a logical one-dimensional preplacement of elements on said surface; performing an affinity driven discrete preplacement optimization; evaluating whether a highest level of regional hierarchy has been attained; iteratively performing a dispersion driven spring system to levelize cell density and an unconstrained sinusoidal optimization; executing a density levelizing procedure; iteratively optimizing while controlling element densities; removing element overlap; iteratively optimizing for desired spacing between elements, adjusting element spacing, and permuting elements; locating elements on grid lines; and iteratively performing a functional sieve crystallization.
申请公布号 WO9800796(A3) 申请公布日期 1998.02.12
申请号 WO1997US11096 申请日期 1997.06.26
申请人 LSI LOGIC CORPORATION 发明人 SCEPANOVIC, RANKO;KOFORD, JAMES, S.;ANDREEV, ALEXANDER, E.
分类号 G06F17/50 主分类号 G06F17/50
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