| 摘要 |
<p>A rear light entry photodetector chip (10) is secured face-down with solder (17a, 17b) on to the front face of a ceramic submount (20) provided with a pair of electrically conductive vias (21a, 21b). A frame-shaped mass (17b) of solder seals the chip to the submount to provide a hermetic enclosure protecting sensitive semiconductor surface areas of the photodetector chip where electric fields are liable to be present in the vicinity of a pn or metal/semiconductor junction.</p> |
