| 摘要 |
<p>A film carrier comprising a conductive circuit formed on one side or inside of an insulating substrate, wherein; when the conductive circuit is formed on one side of the insulating substrate, an opening is formed on the other side of said insulating substrate at a position where a conductive path is to be formed, and when the conductive circuit is formed inside the insulating substrate, an opening is formed on one side or both sides of said insulating substrate at a position where a conductive path is to be formed, said opening comprising a through-hole extending from the surface of the insulating substrate to the surface of the conductive circuit, and a concave formed on the face of the conductive circuit about the opening at the lower end of said through-hole, in a diameter equally extended all around said opening, and said opening being filled with a conductive material to form a conductive path. The film carrier of the present invention can cope with a fine-pitched and high dense mounting, while prohibiting pulling out of the conductive path by an external force. Accordingly, the film carrier is devoid of fallout of the conductive path, which in turn increases electrical connection reliability. <IMAGE></p> |
