发明名称 |
Thermoplastic compositions based on partial aromatic polyamides and polyetherimides |
摘要 |
<p>Thermoplastic moulding materials (I) contg. (A) 1-99 wt% partly aromatic copolyamide contg. (a1) 30-44 mole% terephthalic acid (TPA) units, (a2) 6-25 mole% isophthalic acid (IPA) units, (a3) 43-49.5 mole% hexamethylenediamine (HMDA) units and (a4) 0.5-7 mole% units derived from 6-30C cyclic aliphatic diamines; (B) 1-99 wt% polyether-imide; (C) 0-30 wt% polymeric component with OH gps.; (D) 0-60 wt% fibrous and/or particulate fillers; (E) 0-40 wt% impact modifying rubber; and (F) 0-40 wt% conventional additives, etc.. Also claimed are fibres, films and moulded prods. obtd. from (I).</p> |
申请公布号 |
EP0737719(A3) |
申请公布日期 |
1998.02.11 |
申请号 |
EP19960105295 |
申请日期 |
1996.04.03 |
申请人 |
BASF AKTIENGESELLSCHAFT |
发明人 |
WEBER, MARTIN, DR.;FISCH, HERBERT, DR.;PIPPER, GUNTER;GOTTSCHALK, AXEL, DR. |
分类号 |
C08L71/00;C08L77/00;C08L77/06;C08L79/08;(IPC1-7):C08L77/06;C08L71/10;C08J5/18;D01F6/80;D01F6/74 |
主分类号 |
C08L71/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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