发明名称 BLOW MOLDING DIE DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent the exposure of a part of an embedded component on the surface of a hollow molded product. SOLUTION: A retainer 16 for retaining an embedded component 15 in the state of floating atove a molding face 13 of one mold 11 by the given interval 17 is provided on the mold 11, and a space for wrapping in the embedded component 15 by a parison by mold clamping is formed between the molding face 13 and the embedded component 15 The retainer is provided slidably so that the embedded component 15 is pressed and returned from the parison when the mold closing is further in progress.
申请公布号 JPH1034739(A) 申请公布日期 1998.02.10
申请号 JP19960206556 申请日期 1996.07.17
申请人 CHIYODA SEISAKUSHO:KK 发明人 SEKIGUCHI FUMIYOSHI;YAMAZAKI HARUO;NARAHARA AKIHIRO
分类号 B29C49/48;B29C49/20;B29L22/00;(IPC1-7):B29C49/48 主分类号 B29C49/48
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