发明名称 |
Multi-wire saw device for slicing a semi-conductor ingot into wafers with a cassette for housing wafers sliced therefrom, and slicing method using the same |
摘要 |
A multi-wire saw device for slicing a semiconductor ingot and method therefore provides a plurality of spaced wires for cutting the ingot which is held by two sets of clip boards therebetween. The sets of clip boards form a holding means which may ascend and descend in order to engage the cutting wires. The multi wire saw device includes a cassette having chambers partioned by wires extending between opposite cassette ends and into which individual wafers fall. The cassette is formed with teflon resin for easy entry of the wafers.
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申请公布号 |
US5715806(A) |
申请公布日期 |
1998.02.10 |
申请号 |
US19950572608 |
申请日期 |
1995.12.14 |
申请人 |
SHARP KABUSHIKI KAISHA |
发明人 |
TONEGAWA, TADASHI;WAKUDA, JUNZO |
分类号 |
B28D5/00;B28D5/04;(IPC1-7):B28D1/08 |
主分类号 |
B28D5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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