COMPOSITE FILM AND LEAD FRAME USING THE SAME

摘要

PROBLEM TO BE SOLVED: To prevent the generation of burr at a time of punching excellent in the punching properties used as an adhesive member in a semiconductor package. SOLUTION: In a composite film wherein an adhesive layer is provided on one or both sides of a base film, the total thickness (μm) of the composite film and the end tear resistance value R (kg/20mm) of the base film satisfy a relational expression R>0.6T-8 (when T<=60) and R>=28 (when T>60) and a ratio A/B of the thickness A of the adhesive layer of the composite film and the thickness B of the base film is set to 0.5-1.4.