Molded electronic component having pre-plated lead terminals and manufacturing process thereof

摘要

A molded elecronic component such as a solid electrolyte capacitor comprising a capacitor element including a cathode layer, an anode lead, a pre-plated anode lead terminal connected to the anode lead, a pre-plated cathode lead terminal connected to the cathode layer, and an insulating member which encapsulates the capacitor element and leaves a portion of the anode and cathode lead terminals exposed. The encapsulated portions of the pre-plated anode and cathode lead terminals have a plating layer formed thereon containing organic substances in an amount of 0.03 wt.% or less. Also disclosed is a process for manufacturing the solid electrolyte capacitor. Good connection strength is maintained and solder balls do not form even when the component is subjected to thermal mounting stress.