| 摘要 |
A method of low temperature securing a wire to a bond pad in a microelectronic semiconductor device which includes providing a semiconductor die having a bond pad thereon and providing a wire to be secured to the bond pad. One of the bond pad and wire is rotated relative to the other and the pad is contacted with the wire while the bond pad and the wire are rotating relative to each other until the interface of the wire and the bond pad diffuse into each other sufficiently to provide a bond therebetween upon cooling to secure the wire to the bond pad. Preferably the die is stationary and the wire is rotated. The wire is then cut to a predetermined length. By this method, it is possible to weld together dissimilar metals as well as metals which were previously no available in the fabrication procedures being utilized such as, for example, wherein the wire and the bond pad are both copper, wherein the wire is copper and the bond pad is aluminum, or wherein the wire is copper and the bond pad is titanium tungsten.
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