发明名称 Manufacturing method and manufacturing apparatus for ceramic electronic components
摘要 According to the present invention, ceramic electronic components are produced by a process which includes the steps of forming an unbaked ceramic layer on a surface of an organic flexible supporting body by applying a ceramic paste, the surface having an area that is given a peeling treatment and areas that are not given the peeling treatment; forming first target marks on the flexible supporting body; and positioning and priming electrodes on the unbaked ceramic layer, based upon information obtained through image processing of the first target marks.
申请公布号 US5716481(A) 申请公布日期 1998.02.10
申请号 US19950549220 申请日期 1995.10.27
申请人 TDK CORPORATION 发明人 KOBAYASHI, RYO;ISHIGAKI, TAKAYA;YAGI, HIROSHI;SHIRAI, SHIGEHIKO;TSUNODA, EIZOU;KAWASAKI, KAORU;HOSOGAYA, RYUJI;CHIBA, YASUNORI;YODOKAWA, YOSHIMI;KANZAKI, MINORU;ITO, MASATOSHI;ABE, TAKASHI;IZUMIBE, YASUSHI
分类号 H01G4/30;H05K1/02;H05K1/03;H05K3/46;(IPC1-7):B32B31/12;B32B31/30;B32B35/00 主分类号 H01G4/30
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