发明名称 |
PRODUCTION OF ELECTROLYTIC COPPER FOIL |
摘要 |
PROBLEM TO BE SOLVED: To prepare electrolytic copper foil of a low profile which is useful for production of printed circuit boards and has an excellent etching property. SOLUTION: A sulfuric acid acidic copper sulfate soln. is passed as an electrolyte between a rotating cathode and an anode facing this cathode in this process for producing the electrolytic copper foil. In such a case, this sulfuric acid acidic copper sulfate soln. contains thiourea and/or its deriv. at >=0.5ppm and the flow velocity of the liquid is specified to >=1.5m/sec. The surface roughness (Rz) of the matte surface of the electrolytic copper foil is <=3μm.
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申请公布号 |
JPH1036991(A) |
申请公布日期 |
1998.02.10 |
申请号 |
JP19960207680 |
申请日期 |
1996.07.19 |
申请人 |
JAPAN ENERGY CORP |
发明人 |
KUROSAKI IKUYA;NAGAI TOUBUN;KIMURA TARO;SUZUKI TSUNEO |
分类号 |
H05K1/09;C25D1/04;C25D7/06;(IPC1-7):C25D1/04 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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地址 |
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