发明名称 PRODUCTION OF ELECTROLYTIC COPPER FOIL
摘要 PROBLEM TO BE SOLVED: To prepare electrolytic copper foil of a low profile which is useful for production of printed circuit boards and has an excellent etching property. SOLUTION: A sulfuric acid acidic copper sulfate soln. is passed as an electrolyte between a rotating cathode and an anode facing this cathode in this process for producing the electrolytic copper foil. In such a case, this sulfuric acid acidic copper sulfate soln. contains thiourea and/or its deriv. at >=0.5ppm and the flow velocity of the liquid is specified to >=1.5m/sec. The surface roughness (Rz) of the matte surface of the electrolytic copper foil is <=3μm.
申请公布号 JPH1036991(A) 申请公布日期 1998.02.10
申请号 JP19960207680 申请日期 1996.07.19
申请人 JAPAN ENERGY CORP 发明人 KUROSAKI IKUYA;NAGAI TOUBUN;KIMURA TARO;SUZUKI TSUNEO
分类号 H05K1/09;C25D1/04;C25D7/06;(IPC1-7):C25D1/04 主分类号 H05K1/09
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